INTEL, NVIDIA, SAMSUNG, ASUS, GSKILL
Model
– HBFBU03-6412-B – HBFBU03I-6412-B(WIFI) – HBFBU03-6412-E(EMMC) – HBFBU03I-6412-E(EMMC+WIFI) – HBFBU03-6412-T (EMMC+TPM) – HBFBU03I-6412-T (EMMC+TPM+WIFI)
CPU/Chipset
– Intel® Elkhart Lake SoC Processor (J6412)
BIOS
– AMI Flash ROM
Memory
– 1* DDR4 3200MHz SO-DIMM up to 32GB
Network
– 2* Intel i255V 2.5GbE
Graphics
– Intel® HD Graphics, shared memory – 1* DP (Max Resolution: 4096×2160@60Hz) – 2* HDMI 2.0 (Max Resolution: 4096×2160@60Hz) – Support Triple Displays
Storage
– 1* M.2 M-key (2260/2280, PCIe Gen.3 x2/SATA interface) support NVME – 64GB eMMC onboard (By Model)
Expansion
– 1* M.2 E-key (2230, PCIe Gen.3 x1/USB2.0 interface)
Rear Panel I/O
– 2* RJ45 – 1* DP – 1* DC-in – 2* HDMI – 1* USB3.1(Gen.2)
Front Panel I/O
– 1* Power button + Power LED – 2* USB(TypeC) – 1* Audio(Line out+MIC) – 1* USB2.0 – 1* USB3.1(Gen.2)
Internal Connector
– 64GB eMMC onboard (BY Model) (If use Win 10 OS, we recommend the eMMC is use for OS boot up purpose.)
Power Source
– Adapter
Compliance
– CE, FCC, LVD, RoHS, ErP Ready
Dimensions
– System
Temperature
– Operating Temperature: -20 ~ 60° C (Under the condition of using M.2 interface SSD) – Storage Temperature: -40 ~ 85° C – Humidity: 10% ~ 95% RH @40°C (non-condensing)
OS Support
– Windows 10, Windows 11, Linux
Warranty
– 2 Year limited warranty